ASMPT manufactured MEGA DA multi-chip compatible bonder NEW
Multi-chip die bonder
The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)
- Company：兼松ＰＷＳ
- Price：Other
